Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Endura, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | EnduraApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Endura |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | Cu SIP[2] |
| Model | 0010-13622[1] | Endura[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Deposition | — | Directional eSIP TaN (barrier/seed)[5] |
| Capability | — | Sputters into contacts & vias[5] |
| Chambers | — | eSIP TaN .Tin - Multiple Degas[5] |
| Process type | — | Physical Vapor Deposition (PVD)[2] |
| Wafer size | — | 6 inch[6] |
| Chamber material | — | Copper (Cu)[2] |
| Vintage year | — | 1995[6] |
| OEM | — | Applied Materials[2] |
| Equipment type | — | PVD Chamber (Physical Vapor Deposition)[2] |
| Product details | — | 12" - Cu SIP - Part Numbers: 0010-04662, 0040-48541, 0040-03982[2] |
| Vintage | — | 1996 Vintage[7] |
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