Waferpedia

Comparison ledger

0010-03485 Magnet Assyversus8 SE

Applied Materials 0010-03485 Magnet Assy, Tokyo Electron 8 SE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03485 Magnet AssyApplied Materials
8 SETokyo Electron
OEMApplied MaterialsTokyo Electron
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-03485 Magnet AssyTokyo Electron 8 SE
Specifications
ConfigurationWP AL 300mm PVD[1]High Temperature, Oxide[5]
OEMApplied Materials[1]Tokyo Electron[5]
Model0010-03485[1]8 SE[5]
DescriptionMAGNET ASSY, WP AL 300MM PVD[2]—
ProcessPVD[3]Wet Ox, can be used as Dry Ox[5]
Wafer size300mm[4]8 inch[5]
VersionSpares[4]—
Part Number0010-03485[1]—
ManufacturerApplied Materials[1]—
Process TypePVD (Physical Vapor Deposition)[1]High Temperature Oxide, Wet Oxidation, Dry Oxidation[5]
Application (Material)Aluminum (AL)[1]—
Wafer Diameter (associated)300 mm[1]—
System description—High Temperature, Oxide[5]
Temperature range / max—1200~1250*C[5]
Product family—TELFORMULA Alpha 303i / ATP Alpha 8-SE / ATP[6]
Footprint—Smallest footprint worldwide; 1100 mm wide[6]
Control—Equipped with proven ART (Adaptive Realtime Temperature) Control[6]
Productivity—High productivity powered by thermo plug[6]
Supported Wafer Size—8 inch[5]
Maximum Temperature Range—1200~1250 °C[5]
Product Series—ALPHA-303i series[6]
Machine Footprint Width—1100 mm[6]
Temperature Control—ART (Adaptive Realtime Temperature) Control[6]
Compliance—JG/SEMI Standards[6]
Temperature range—1200~1250°C[5]
Process type—High temperature oxide processing[5]
Oxidation type—Wet or dry oxidation[5]
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]layla-ec.comlayla-ec.com
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]inventory listing
  6. [6]web.archive.orgweb.archive.org