Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Lam Research Gasonics L 3510, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | Gasonics L 3510Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Lam Research Gasonics |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | With:[5] |
| OEM | Applied Materials[1] | Lam Research / Gasonics[5] |
| Model | 0010-03485[1] | L 3510[5] |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Microwave Power | — | 0–1200 watts at 2.45 GHz[6] |
| Pressure Range | — | 0.5 to >5.0 torr[6] |
| Platen Temperature | — | 100–300 °C[6] |
| Ash Rate | — | Up to 3.5 µm/min (process dependent)[6] |
| Throughput | — | 45–60 wafers per hour[6] |
| Within Wafer Uniformity | — | ±5% to 10% (process dependent)[6] |
| Wafer-to-Wafer Uniformity | — | ±5% to 10% (process dependent)[6] |
| Process Gases | — | O₂, N₂ (O₂ 5 SLM, N₂ 1 SLM typical)[6] |
| Wafer Size | — | 75 mm to 200 mm (3 to 8 inch)[7] |
| Type | — | Plasma asher[5] |
| Process type | — | Downstream microwave plasma ashing[7] |
| Wafer size support | — | 75 mm to 200 mm (3 to 8 inch); up to 8 inch capability[7] |
| Wafer handling | — | Z-Bot for 6" and 8" wafers[5] |
| Gas delivery | — | Accurate 354 C Gas Control System[5] |
| Vacuum pump | — | Abara A 70 W Dry Pump[5] |
| Process gases | — | O2, N2[7] |
| Ash rate | — | Up to 3.5 µm/min[7] |
| Wafer transfer | — | Integrated solid robotic wafer transfer[6] |
| Cassette station | — | Fixed, more stable[6] |
| Controller | — | Allwin21 PC with touch screen monitor[6] |