Waferpedia

Comparison ledger

0010-03254 E Chuckversus8 SE

Applied Materials 0010-03254 E Chuck, Tokyo Electron 8 SE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
8 SETokyo Electron
OEMApplied MaterialsTokyo Electron
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Tokyo Electron 8 SE
Specifications
Configuration—High Temperature, Oxide[1]
OEM—Tokyo Electron[1]
Model—8 SE[1]
Wafer size—8 inch[1]
System description—High Temperature, Oxide[1]
Temperature range / max—1200~1250*C[1]
Process—Wet Ox, can be used as Dry Ox[1]
Product family—TELFORMULA Alpha 303i / ATP Alpha 8-SE / ATP[2]
Footprint—Smallest footprint worldwide; 1100 mm wide[2]
Control—Equipped with proven ART (Adaptive Realtime Temperature) Control[2]
Productivity—High productivity powered by thermo plug[2]
Supported Wafer Size—8 inch[1]
Process Type—High Temperature Oxide, Wet Oxidation, Dry Oxidation[1]
Maximum Temperature Range—1200~1250 °C[1]
Product Series—ALPHA-303i series[2]
Machine Footprint Width—1100 mm[2]
Temperature Control—ART (Adaptive Realtime Temperature) Control[2]
Compliance—JG/SEMI Standards[2]
Temperature range—1200~1250°C[1]
Process type—High temperature oxide processing[1]
Oxidation type—Wet or dry oxidation[1]
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org