Waferpedia

Comparison ledger

0010-03254 E ChuckversusWS-650-23 B Spin

Applied Materials 0010-03254 E Chuck, Laurell WS-650-23 B Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
OEMApplied MaterialsLaurell
Category——
Wafer size——
Process node——
Introduced——
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Family—Laurell WS-650-23 B Spin
Specifications
Maximum Substrate Size—ø150 mm wafers; 5" × 5" (127 mm × 127 mm) substrates[1]
Maximum Rotational Speed—12,000 RPM (based on a ø100 mm silicon wafer)[1]
Process Controller—650-series microprocessor controller with PC software support (Spin 3000); real-time interaction, pausing, stopping, and continuation[1]
Power Requirements—95 to 240 VAC, 47/63 Hz, ~300 W[1]
Vacuum Requirements—25–28 inHg (635–711 mm Hg) with flow 4.5 SCFM (0.127 m³/min) at 0 inHg[1]
Nitrogen Purge Pressure—60–70 PSIG (4–5 bar) of N₂ or CDA; consumption 3 ft³/h (0.085 m³/h) for standard motor, 20 ft³/h (0.566 m³/h) for high-performance motor[1]
Housing Material—Solid co-polymer blend (proprietary); optional PTFE (Hostaflon TFM-1600 / Teflon AF) for high-temperature chemistry[1]
Safety Certifications—ETL, UL, CSA, CE, RoHS compliant; door interlock, vacuum interlock, lid interlock[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]laurell.comlaurell.com