Waferpedia

Comparison ledger

TechCut 4 Precisionversus321

Allied High Tech TechCut 4 Precision, Disco 321, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
TechCut 4 PrecisionAllied High Tech
321Disco
OEMAllied High TechDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAllied High Tech TechCut 4 PrecisionDisco 321
Cited variants
  • TechCut 4 model 5-5100[1]
—
Specifications
ModelTechCut 4™[1]321[2]
Item Number#5-5000, #5-5000-230[1]—
DescriptionLow Speed Saw[1]—
Voltage115 V AC (50/60 Hz) or 230 V AC (50/60 Hz)[1]—
Power1/17 HP (45 W)[1]—
Fuse5 A Slow Blow, 5 x 20 mm, 250 V[1]—
Dimensions (W x D x H)11" x 17" x 14" (280 mm x 432 mm x 355 mm)[1]—
Weight38 lb (17 kg)[1]—
Shipping Dimensions24" x 34" x 21" (610 mm x 864 mm x 533 mm)[1]—
Shipping Weight50 lb (22.7 kg)[1]—
Recommended Operational Temperature Range50°F (10°C) to 80°F (26°C)[1]—
Blade Speed Range0 to 500 RPM[1]—
Blade Diameter Range3 to 6 inches with ½-inch arbor[1]—
Micrometer Resolution1 micron (μm)[1]—
Included WeightsTwo 150-gram stainless steel weights[1]—
Included FixturesThree fixtures: 5-5005, 5-5010, 5-5020[1]—
OEM—Disco[2]
Equipment type—Wafer Dicing Saw[2]
Facility context—Cleanroom Instrumentation[2]
Application area—Nano and Micro Fabrication[2]
Location—FNT 4.106[2]
Wafer Size—Up to 6 inches[3]
Spindle Power—1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[4]
Spindle Power (alternate)—1500 Watt spindle[3]
Non-Contact Setup—Non Contact Setup[4]
Microscope—Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[4]
Broken Blade Detection—Broken Blade Detection[4]
Light Tower—Includes Light Tower[4]
Chuck Type—6" Universal Chuck (or 6" Porous Film Frame Chuck)[3]
Wafer size capability—Up to 6" wafers[4]
Chuck—6-inch porous film frame chuck[3]
Spindle power—1500-watt spindle[3]
Footprint—Small footprint[3]
Setup—Non-contact setup[4]
Blade break detection—Broken blade detection[4]
Other features—Floppy drive, light tower, blade tools, manuals[4]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]mse.ucr.edumse.ucr.edu
  2. [2]tmi.utexas.edutmi.utexas.edu
  3. [3]jmind.comjmind.com
  4. [4]gtsaz.comgtsaz.com