Waferpedia

Comparison ledger

4155BversusR50-4PP

Agilent 4155B, Filmetrics R50-4PP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
4155BAgilent
R50-4PPFilmetrics
OEMAgilentFilmetrics
CategoryElectrical measurementElectrical measurement
Wafer size—525 um +/- 25 um sample thickness default configuration
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAgilent 4155BFilmetrics R50-4PP
Cited variants—
Specifications
Instrument roleDC instrument (SPA)[2]—
Associated systemMPI TS150 probe station[2]—
Measurement typeDC impedance measurements[2]—
Current measurement resolution10 fA[1]—
Offset current3 pA[1]—
Voltage measurement resolution (differential mode)1 µV[1]—
Maximum output voltage (with HPSMU)200 V[1]—
Maximum output current (with HPSMU)1 A[1]—
Minimum sampling interval60 µs[1]—
Maximum number of data points10001[1]—
Number of SMUs4[3]—
Range change modeAuto / Fixed / Limited Auto[1]—
Compatible layers—Metal, Conductive Oxide, Silicon and Polysilicon[4]
Default configuration—Configured by default for metallic layers and sample thickness of 525 um +/- 25 um[4]
Measurement range—5 mOhm/sq to 5MOhm/sq[4]
Measurement area—10x 10 to 200 x 200 mm[4]
Accuracy—+/- 1%[4]
Repeatability—< 0.5 %[4]
Temperature compensation—Yes[4]
Mapping—2D and 3D mapping[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]wiki.epfl.chwiki.epfl.ch
  2. [2]epfl.chepfl.ch
  3. [3]manualslib.commanualslib.com
  4. [4]epfl.chepfl.ch