Waferpedia

Comparison ledger

350 D Ionversus200 PCU

Agilent 350 D Ion, Axcelis 200 PCU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
350 D IonAgilent
200 PCUAxcelis
OEMAgilentAxcelis
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2000 Vintage
Control system——
Generation——
FamilyAgilent 350Axcelis NV GSD 200
Cited variants—
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
Specifications
Configuration150mm High Current IMP[3]—
TypeHigh Current Ion Implanter[3]—
Wafer Size150 mm[3]—
P/N—SC 4840 A[4]
Frequency—50 Hz[4]
Phase—3 Phase[4]
Voltage—400 V[4]

Plan your fab

Building a Ion Implantation process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing