Comparison ledger
ADT 966 Wafer Mounting, Applied Materials 0010-21246 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-21246 PartApplied Materials | |
|---|---|---|
| OEM | ADT | Applied Materials |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ADT 966 Wafer Mounting | — |
| Cited variants |
| — |
| Specifications | ||
| Supported tapes | Dicing Blue-tapes / UV tapes[1] | — |
| Max workpiece size | Ø 200 mm (8 inch)[1] | — |
| Supported film frames | DTF 2-8-1; DTF 2-6-1; 350-103; 350-104; DTF-2-12; SEMI-G74[1] | — |
| Machine dimensions (W x D x H) | 420 x 860 x 370 mm[1] | — |
| Approx. machine weight | 45 kg[1] | — |
| Temperature-controlled chuck heater | Yes[1] | — |
| Built-in vacuum holder | Yes[1] | — |
| UV back tape collector | Yes[1] | — |
| Anti-static roller | Yes[1] | — |