Waferpedia

Comparison ledger

7120 MD Dicingversus20 36 Surface

ADT 7120 MD Dicing, Blanchard 20 36 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMADTBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyADT 7120 MD DicingBlanchard 20 36 Surface
Specifications
Wafer size8 inch[1]—
Configuration—With new Elecro-Matic Neutrol II Magnetic Chuck Control[2]
Magnetic Chuck Control—Electro-Matic Neutrol II[2]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing