Waferpedia

Comparison ledger

UF 300versus2001 CX

Accretech UF 300, Electroglas 2001 CX, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Test & Probe, null[1]
Side-by-side comparison of selected equipment models
Attribute
UF 300Accretech
2001 CXElectroglas
OEMAccretechElectroglas
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 300Electroglas EG 2001
Cited variants
  • UF 300 A Automatic Wafer[2]
—
Specifications
ConfigurationIncludes Loader[3]Single channel[5]
OCRYes[3]—
InterfaceGPIB[3]—
Cleaning PadYes / Ceramic[3]—
Chuck ControllerAmbient to 125°C[3]—
XY Position AccuracyYes[3]—
Needle AlignmentYes[3]—
Auto Needle Height SettingYes[3]—
GPIBYes[3]—
Auto AlignmentYes, Needle & Wafer[3]—
Wafer LoaderFoup & Inspection Tray[3]—
ManufacturerAccretech / TSK[3]—
ModelUF 300[3]2001 CX[5]
CategoryTest & Probe[4]Prober[5]
Wafer sizes8 inch, 12 inch[3]—
Includes loaderYes[3]—
Chuck12 inch chuck[3]—
Color LCR displayYes[3]—
Operator terminal & keyboardIncluded[3]—
Power cord for proberIncluded[3]—
Floppy disk with configuration filesIncluded[3]—
Backup of configuration filesOn internal hard drive inside the prober[3]—
Power CordIncluded[3]—
Backup of Configuration Files on Internal Hard DriveIncluded[3]—
Make—Electroglas[5]
Wafer Size—6 inch[5]
Channel Configuration—Single channel[5]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]sec.govsec.gov
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]inventory listing