Comparison ledger
Accretech UF 300 A Automatic Wafer, Tokyo Electron Precio Automatic Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 300 A Automatic WaferAccretech | Precio Automatic WaferTokyo Electron |
|---|---|---|
| OEM | Accretech | Tokyo Electron |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | Single Foup Wafer Loader (Right) |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2001 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 300 | Tokyo Electron Precio |
| Specifications | ||
| Configuration | Nickel chuck[2] | 50/60 Hz[1] |
| Phase | 1 Phase[2] | 1 Phase[5] |
| Cognex board type | 8200[3] | — |
| Voltage | 208V[3] | — |
| OEM | Accretech / TSK[2] | — |
| Model | UF 300 A[2] | Precio[1] |
| Equipment type | Automatic Wafer Prober[2] | — |
| Wafer size | 8 inch[2] | Single Foup Wafer Loader (Right)[6] |
| Chuck | Nickel chuck[2] | — |
| Power | 1 Phase[2] | 2.9 kVA[5] |
| Vintage | 2001[2] | 2015[1] |
| Keyboard/joystick | Keyboard, joystick[3] | — |
| Storage | 3.5" floppy disk / 3.5" hard disk[3] | — |
| Printer | Internal printer[3] | — |
| Interfaces | GPIB I/F, RS232 I/F, Ethernet I/[3] | — |
| Functions | Probe mark inspection; automatic probe to pad alignment; multi-die probing up to 256 DUTs; multi function cleaning pad; automatic needle height alignment; soak time option; new E2 camera update[3] | — |
| Chuck Type | Nickel chuck (some units) or gold plated chuck (other units)[3] | — |
| Automation | Fully automatic[3] | — |
| Probe Card Change | Included[3] | — |
| User Interface | Keyboard, joystick, 3.5" floppy disk / hard disk, internal printer[3] | — |
| Vision System | Cognex board type 8200, New E2 camera update[3] | — |
| Probing Features | Multi-die probing up to 256 DUTs, automatic probe to pad alignment, probe mark inspection, automatic needle height alignment[3] | — |
| Cleaning | Multi function cleaning pad[3] | — |
| Soak Option | Soak time option[3] | — |
| Rated Power Input | — | 200 V[1] |
| Rated Breaker Input | — | 30 A[1] |
| Wafer Size | — | 12 inch[1] |
| Frequency | — | 50/60 Hz[1] |
| Power Input | — | 200 V[1] |
| Breaker Rating | — | 30 A[1] |
| kVA Rating | — | 2.9 kVA[5] |
| Loader Type | — | Single Foup Loader (Right)[1] |
| Interface Options | — | GPIB Tester Interface Options, Top Plate Unit, V93K PIB & Pogo Docking Type[1] |
| Vintage Year | — | 2015[1] |
| Make | — | Tel[1] |
| Power rating | — | 2.9 kVA[5] |
| Wafer loader | — | Single Foup Loader (Right)[1] |
| Tester interface | — | GPIB[1] |
| Available options | — | Top Plate Unit, V93K PIB & Pogo Docking Type[1] |
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