Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF3000, KLA Surfscan SP 1 DLS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF3000Accretech | |
|---|---|---|
| OEM | Accretech | KLA |
| Category | — | — |
| Wafer size | Wafer Equipment | For Wafer Centering Device |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF3000 | KLA Surfscan |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | For Wafer Centering Device[4] |
| Currently Configured for | 300mm[1] | — |
| With Chiller | SCU-600B[1] | — |
| Section 1 | Tool General Information[1] | — |
| Section 2 | Tool Specific Information[1] | — |
| Manufacturer | Accretech, Tokyo Semitsu Kogaku (TSK)[1] | — |
| Model | UF3000[1] | SP1 DLS[6] |
| Category | Wafer Equipment[1] | — |
| Equipment type | Wafer Prober[1] | — |
| Tool status | In production[1] | — |
| Tool location | Cleanroom[1] | — |
| Chiller | SCU-600B[1] | — |
| Vendor tool serial number | F24006MZ[1] | — |
| Micron MISTI/LID number | FE3SKAA300(TMM)[1] | — |
| Year | 2004[2] | — |
| Quantity | 9[3] | — |
| Short description | Fully Automated Prober[3] | — |
| Version | 300 mm[3] | — |
| Nickel chuck | 12 inch[3] | — |
| Front loading | 300 mm single FOUP loading[3] | — |
| Robot blade | Dual ceramic robot blade[3] | — |
| Software version | S5.0FC4[3] | — |
| Loader type | TSK[3] | — |
| Chuck temperature range | 30~150℃[3] | — |
| OCR camera type | Type6[3] | — |
| Auto card change | Yes[3] | — |
| Needle cleaning unit | 150 mm x 150 mm ceramics pad[3] | — |
| Manipulator | Hinge, MHF4000[3] | — |
| Test system interface | AL6050 & Focus3000[3] | — |
| Includes | Printer[3] | — |
| Configuration | — | Upgraded/New[4] |
| Defect Sensitivity (Polished Bare Silicon) | — | 0.050 µm[5] |
| Laser Source | — | Argon Ion Laser (488 nm)[5] |
| Wafer Size Support | — | 200 mm and 300 mm[5] |
| Enhanced Rough Film Sensitivity | — | Yes[5] |
| Real Time Defect Classification (RTDC) | — | Yes[5] |
| Defect Map and Histogram with Zoom | — | Yes[5] |
| Map to Map | — | Yes[5] |
| Operator Interface | — | Yes[5] |
| Blower Unit | — | Yes[5] |
| OEM | — | KLA-Tencor[5] |
| Wafer Size | — | 200/300mm[5] |
| Defect Sensitivity | — | 0.050um on polished bare silicon[5] |
| Surface Type | — | Unpatterned[5] |
| Key Feature | — | Enhanced Rough Film Sensitivity[5] |
| Optional Handler | — | 300mm Single FOUP/FIMS Handler[5] |