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Comparison ledger

-407B-2-S-CE-S293 RobotversusACS300 Gen3

ABM -407B-2-S-CE-S293 Robot, SUSS MicroTec ACS300 Gen3, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACS300 Gen3SUSS MicroTec
OEMABMSUSS MicroTec
Category——
Wafer size—300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—Gen3
FamilyABM -407B-2-S-CE-S293 RobotSUSS MicroTec ACS300 Gen3
Specifications
ModelABM-407B-2-S-CE-S293[1]—
DescriptionROBOT[1]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
System type—Automated[2]
Max wafer size—300 mm[2]
Process capabilities—Priming, Spin Coating, Baking, Aqueous / Solvent Developing[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]hilpert.chhilpert.ch