Comparison ledger
ABM -407B-2-S-CE-S293 Robot, Disco DAG 810 Ring Removal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DAG 810 Ring RemovalDisco | |
|---|---|---|
| OEM | ABM | Disco |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | Disco DAG 810 |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Configuration | — | Convertible to 8"[2] |
| Supported workpiece size | — | Up to Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table)[3] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[3] |
| Grinding wheel diameter | — | Φ200 mm[3] |
| Spindle rated output | — | 4.2 kW[3] |
| Spindle rated torque | — | 5.9 N·m[3] |
| Spindle rotation speed range | — | 1,000 – 7,000 min⁻¹[3] |
| Equipment dimensions (W × D × H) | — | 600 × 1,700 × 1,780 mm[3] |
| Equipment weight | — | Approx. 1,300 kg[3] |
| Wafer size (ring removal variant) | — | 6 inch (convertible to 8 inch)[2] |