Comparison ledger
ABM -407B-1-S-CES293 Robot, Tokyo Electron 8 SE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8 SETokyo Electron | |
|---|---|---|
| OEM | ABM | Tokyo Electron |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | Tokyo Electron 8 SE |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | 8 SE[2] |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Configuration | — | High Temperature, Oxide[2] |
| OEM | — | Tokyo Electron[2] |
| Wafer size | — | 8 inch[2] |
| System description | — | High Temperature, Oxide[2] |
| Temperature range / max | — | 1200~1250*C[2] |
| Process | — | Wet Ox, can be used as Dry Ox[2] |
| Product family | — | TELFORMULA Alpha 303i / ATP Alpha 8-SE / ATP[3] |
| Footprint | — | Smallest footprint worldwide; 1100 mm wide[3] |
| Control | — | Equipped with proven ART (Adaptive Realtime Temperature) Control[3] |
| Productivity | — | High productivity powered by thermo plug[3] |
| Supported Wafer Size | — | 8 inch[2] |
| Process Type | — | High Temperature Oxide, Wet Oxidation, Dry Oxidation[2] |
| Maximum Temperature Range | — | 1200~1250 °C[2] |
| Product Series | — | ALPHA-303i series[3] |
| Machine Footprint Width | — | 1100 mm[3] |
| Temperature Control | — | ART (Adaptive Realtime Temperature) Control[3] |
| Compliance | — | JG/SEMI Standards[3] |
| Temperature range | — | 1200~1250°C[2] |
| Process type | — | High temperature oxide processing[2] |
| Oxidation type | — | Wet or dry oxidation[2] |